Mitsubishi Heavy Industries Technical Review
    Vol. 57 No. 3 (2020)   Machine Tools
    Technical Papers

    Room-temperature Wafer Bonder Applicable to Manufacturing of Semiconductor Devices in Various Fields

    Takayuki Goto

    The room-temperature bonding technique enables strong bonding without applying heat. As it can be used with diverse materials, this technique has recently been applied in various device fields. Mitsubishi Heavy Industries Machine Tool Co., Ltd. manufactures and markets room-temperature wafer bonders that can be used for various purposes, ranging from research and development (R&D) to device mass production and is expanding the applicable fields for room-temperature bonding.