MHI Machine Tool News http://www.mhi.co.jp/en/machinetool/index.html en Machine Tool offers the latest corporate information via RSS web feeds. All Rights Reserved, Copyright (C) 2011, MITSUBISHI HEAVY INDUSTRIES, LTD. Mon, 16 Jan 2012 13:30:00 +0900 <![CDATA[MHI Develops World's First 12-inch Wafer Bonding Machine]]> Mon, 16 Jan 2012 13:30:00 +0900 <![CDATA[MHI Continues to Grow as a Leading Manufacturer of Gear Cutting Machines History of MHI Gear Machine Tools over 50 Years]]> Thu, 08 Dec 2011 14:10:00 +0900 <![CDATA[MHI Develops World's First Technology Enabling One Grinding Machine]]> Thu, 08 Dec 2011 11:30:00 +0900 <![CDATA[MHI to Intensify Gear Cutting Machine Marketing in the U.S.101:]]> Tue, 01 Nov 2011 13:50:01 +0900 <![CDATA[Bulletin Board Notice re MHI's Support Stance for Machine Tool Users]]> Mon, 31 Oct 2011 13:00:01 +0900 <![CDATA[MHI Develops World's First 8-inch Wafer Bonding Machine]]> Mon, 11 Jul 2011 14:00:01 +0900 <![CDATA[MHI's "microV1" Micro Milling Machine Achieves Machining]]> Thu, 07 Jul 2011 13:40:01 +0900 <![CDATA[MHI Develops "MV80" Vertical Machining Center for Long Workpieces,]]> Thu, 24 Mar 2011 11:00:01 +0900 <![CDATA[MHI Develops Plano Type 5-face Machining Center, "MVR-5X,"]]> Fri, 11 Mar 2011 11:00:01 +0900 <![CDATA[MHI Develops "ZE15B" Gear Grinding Machine]]> Mon, 24 Jan 2011 11:00:01 +0900 <![CDATA[MHI Develops "ZE40A" Universal Gear Grinding Machine]]> Thu, 20 Jan 2011 11:00:01 +0900 <![CDATA[MHI to Produce Gear Cutting Machines in China,]]> Mon, 02 Aug 2010 11:00:01 +0900 <![CDATA[World's First Direct Bonding of SiC-Si and GaN-Si at Room Temperature]]> Thu, 22 Jul 2010 11:00:01 +0900 <![CDATA[MHI to Market "ZGA2000" Large-size Gear Grinding Machine:]]> Mon, 24 May 2010 11:00:01 +0900 <![CDATA[MHI to Market "GEA1200" ,First Model in New "GEA Series":]]> Thu, 13 May 2010 11:00:01 +0900