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Example M-iPIS (Mitsubishi Integrated Piping & Instrument System) applications

Thanks to its utilization of state-of-the-art joining technology, M-iPIS can be used to manufacture heat exchanger plates for large-scale liquid crystal manufacturing systems, an application where M-iPIS is highly regarded for its thermal soaking properties, air tightness, reliability, and light weight.

Cooling plate

Cooling plate

Electrodes

Electrodes

Temperature-regulating plates

Temperature-regulating plates

Cooling plates

Cooling plates

Cooling plates for semiconductors

Cooling plates for semiconductors

Temperature-regulating plates for industrial applications

Temperature-regulating plates for industrial applications

Temperature-regulating plates for industrial applications

Temperature-regulating plates for industrial applications

Cooling plates

Cooling plates

Cooled cases for electronic components (manufactured by joining cast aluminum and extruded aluminum parts)

Cooled cases for electronic components
(manufactured by joining cast aluminum and extruded aluminum parts)

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Business contact: Transportation Systems & Advanced Technology Division Advanced Mechanical Systems Department +81-848-67-2815
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