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Ritto Machinery Works

2012FY

April 26, 2012: MHI to Acquire Federal Broach Holdings To Boost Presence in Global Cutting Tool Market

April 18, 2012: MHI to Launch Gear Cutting Machine Production in Bengaluru, India, To Meet Vigorous Demand from Local Auto-related Sectors -- Move Enables Integrated Marketing, Servicing of Machines and Tools --

April 16, 2012: MHI Develops "LH250": Double Column Machining Center Enabling High-precision Machining with 5 micro meter Level Accuracy For Long, Difficult-to-cut Plate Materials and Die Molds Up to 2 Meters

2011FY

February 28, 2012: MHI Introduces New Series of High-rigidity Horizontal Boring Mills Enabling High-speed, High-accuracy, High-power Milling - Two New Models with 150 and 180 mm Boring Spindle Diameters -

January 16, 2012: MHI Develops World's First 12-inch Wafer Bonding Machine Capable of Producing 3-D Integrated LSI Circuits at Room Temperature -- First Unit Delivered to AIST, Japan --

December 08, 2011: MHI Develops World's First Technology Enabling One Grinding Machine To Perform High-speed, High-Precision Machining of Diverse Gear Types:Internally Toothed, Externally Toothed and Stepped -- Also Realizes Low-cost Processing through to Finishing --