Machine Tool
2011FY
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January 16, 2012
- MHI Develops World's First 12-inch Wafer Bonding Machine Capable of Producing 3-D Integrated LSI Circuits at Room Temperature -- First Unit Delivered to AIST, Japan --
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December 08, 2011
- MHI Develops World's First Technology Enabling One Grinding Machine To Perform High-speed, High-Precision Machining of Diverse Gear Types:Internally Toothed, Externally Toothed and Stepped -- Also Realizes Low-cost Processing through to Finishing --
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November 01, 2011
- MHI to Intensify Gear Cutting Machine Marketing in the U.S. And Aggressively Explore Demand for Overseas Production -- Technological Expertise to be on Display at Gear Expo 2011 --
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July 11, 2011
- MHI Develops World's First 8-inch Wafer Bonding Machine To Produce 3-D Integrated LSI Circuits at Room Temperature -- Effective Activation of Metal Surface Enabled by Atom Beam Radiation --
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July 07, 2011
- MHI's "microV1" Micro Milling Machine Achieves Machining Of 4 Difficult-to-Cut Wafer Materials, Including SiC and Sapphire -- Production Time and Cost Reduced by Eliminating Photomask Process --
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June 13, 2011
- MHI to Market "SEA1600" Large-size Gear Shaping Machines Capable of Machining Up to 1,600mm Diameter Workpieces -- Cycle-time Shortened with New Main Spindle Rapid Return System --
2010FY
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March 24, 2011
- MHI Develops "MV80" Vertical Machining Center for Long Workpieces, Primarily Targeting Machining Shops Making Parts and Metallic Molds For Aircraft and Power Generation Equipment
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March 11, 2011
- MHI Develops Plano Type 5-face Machining Center, "MVR-5X," Suitable for Processing of Free-form Curved Surfaces - Adoption of Attachment with 2 Spindles Enables Wider Applications -
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January 24, 2011
- MHI Develops "ZE15B" Gear Grinding Machine Enabling High-speed, High-accuracy Volume Production - Shorter Non-operational Time for Higher Productivity -
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January 20, 2011
- MHI Develops "ZE40A" Universal Gear Grinding Machine Ideal for Production of Wide Variety of Gears in Small Lots - Accommodates Both Generating and Profile Grinding, also Bias Modification -
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August 02, 2010
- MHI to Produce Gear Cutting Machines in China, Applying New "Shared Factory" Scheme
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July 22, 2010
- World's First Direct Bonding of SiC-Si and GaN-Si at Room Temperature Achieved by MHI Bonding Machine -- Leads Way for New Device Development --
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May 24, 2010
- MHI to Market "ZGA2000" Large-size Gear Grinding Machine: First in Japan Enabling High-speed, High-Precision Machining Of Up to 2 Meter Diameter Workpieces Achieves Significant Idle Time Reduction and Enhanced Operability
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May 13, 2010
- MHI to Market "GEA1200", First Model in New "GEA Series": High-efficiency, High-precision Gear Hobbing Machines Enabling Machining of Over 1 Meter Diameter Large-size Gears
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April 08, 2010
- MHI's Room-Temperature Bonding Machine for 8-inch Wafers Begins Operation at MEMS Manufacturer in Japan -- User Support Program "MBSP" Launched --
2009FY
2008FY
2007FY
