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Machine Tool

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News 2011FY

Lists by Year

2011FY News Release

January-March

January 16, 2012: MHI Develops World's First 12-inch Wafer Bonding Machine Capable of Producing 3-D Integrated LSI Circuits at Room Temperature -- First Unit Delivered to AIST, Japan --

October-December

December 08, 2011: MHI Continues to Grow as a Leading Manufacturer of Gear Cutting Machines
History of MHI Gear Machine Tools over 50 Years

December 08, 2011: MHI Develops World's First Technology Enabling One Grinding Machine To Perform High-speed, High-Precision Machining of Diverse Gear Types: Internally Toothed, Externally Toothed and Stepped -- Also Realizes Low-cost Processing through to Finishing --

November 01, 2011: MHI to Intensify Gear Cutting Machine Marketing in the U.S.
And Aggressively Explore Demand for Overseas Production -- Technological Expertise to be on Display at Gear Expo 2011 --

October 31, 2011: Bulletin Board Notice re MHI's Support Stance for Machine Tool Users

July-September

July 11, 2011: MHI Develops World's First 8-inch Wafer Bonding Machine To Produce 3-D Integrated LSI Circuits at Room Temperature -- Effective Activation of Metal Surface Enabled by Atom Beam Radiation --

July 07, 2011: MHI's "microV1" Micro Milling Machine Achieves Machining Of 4 Difficult-to-Cut Wafer Materials, Including SiC and Sapphire -- Production Time and Cost Reduced by Eliminating Photomask Process --