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Machine Tool

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News 2010FY

Lists by Year

2010FY News Release

January-March

March 24, 2011: MHI Develops "MV80" Vertical Machining Center for Long Workpieces, Primarily Targeting Machining Shops Making Parts and Metallic Molds For Aircraft and Power Generation Equipment

March 11, 2011: MHI Develops Plano Type 5-face Machining Center, "MVR-5X," Suitable for Processing of Free-form Curved Surfaces - Adoption of Attachment with 2 Spindles Enables Wider Applications -

January 24, 2011: MHI Develops "ZE15B" Gear Grinding Machine Enabling High-speed, High-accuracy Volume Production - Shorter Non-operational Time for Higher Productivity -

January 20, 2011: MHI Develops "ZE40A" Universal Gear Grinding Machine Ideal for Production of Wide Variety of Gears in Small Lots - Accommodates Both Generating and Profile Grinding, also Bias Modification -

July-September

August 02, 2010: MHI to Produce Gear Cutting Machines in China, Applying New "Shared Factory" Scheme

July 22, 2010: World's First Direct Bonding of SiC-Si and GaN-Si at Room Temperature Achieved by MHI Bonding Machine -- Leads Way for New Device Development --

April-June

May 24, 2010: MHI to Market "ZGA2000" Large-size Gear Grinding Machine: First in Japan Enabling High-speed, High-Precision Machining Of Up to 2 Meter Diameter Workpieces Achieves Significant Idle Time Reduction and Enhanced Operability

May 13, 2010: MHI to Market "GEA1200", First Model in New "GEA Series": High-efficiency, High-precision Gear Hobbing Machines Enabling Machining of Over 1 Meter Diameter Large-size Gears

April 08, 2010: MHI's Room-Temperature Bonding Machine for 8-inch Wafers Begins Operation at MEMS Manufacturer in Japan -- User Support Program "MBSP" Launched --