Top of page.
Skip to main contents.
Skip to sub menu.
Skip to main menu.
Skip to footer.
Main menu.
MHI Group
HOME
Global
Japanese
Contact MHI
Changing Text Size
Text Size
Small
Middle
Large
Products
Technology
About MHI
Investor Relations
CSR
News
Discover MHI
HOME
>
Machine Tool
>
News
> 2010FY
Sub menu.
Profile
Products
Technology
Inquiry
Site Map
Return to top.
Main contents start here.
News 2010FY
Lists by Year
2012FY
2011FY
2010FY
2009FY
2008FY
2007FY
2006FY
2010FY News Release
January-March
March 24, 2011
MHI Develops "MV80" Vertical Machining Center for Long Workpieces, Primarily Targeting Machining Shops Making Parts and Metallic Molds For Aircraft and Power Generation Equipment
March 11, 2011
MHI Develops Plano Type 5-face Machining Center, "MVR-5X," Suitable for Processing of Free-form Curved Surfaces - Adoption of Attachment with 2 Spindles Enables Wider Applications -
January 24, 2011
MHI Develops "ZE15B" Gear Grinding Machine Enabling High-speed, High-accuracy Volume Production - Shorter Non-operational Time for Higher Productivity -
January 20, 2011
MHI Develops "ZE40A" Universal Gear Grinding Machine Ideal for Production of Wide Variety of Gears in Small Lots - Accommodates Both Generating and Profile Grinding, also Bias Modification -
July-September
August 02, 2010
MHI to Produce Gear Cutting Machines in China, Applying New "Shared Factory" Scheme
July 22, 2010
World's First Direct Bonding of SiC-Si and GaN-Si at Room Temperature Achieved by MHI Bonding Machine -- Leads Way for New Device Development --
April-June
May 24, 2010
MHI to Market "ZGA2000" Large-size Gear Grinding Machine: First in Japan Enabling High-speed, High-Precision Machining Of Up to 2 Meter Diameter Workpieces Achieves Significant Idle Time Reduction and Enhanced Operability
May 13, 2010
MHI to Market "GEA1200", First Model in New "GEA Series": High-efficiency, High-precision Gear Hobbing Machines Enabling Machining of Over 1 Meter Diameter Large-size Gears
April 08, 2010
MHI's Room-Temperature Bonding Machine for 8-inch Wafers Begins Operation at MEMS Manufacturer in Japan -- User Support Program "MBSP" Launched --
Return to top.
Page Top