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Machine Tool
News
January 16, 2012
MHI Develops World's First 12-inch Wafer Bonding Machine Capable of Producing 3-D Integrated LSI Circuits at Room Temperature -- First Unit Delivered to AIST, Japan --
December 08, 2011
MHI Continues to Grow as a Leading Manufacturer of Gear Cutting Machines
History of MHI Gear Machine Tools over 50 Years
December 08, 2011
MHI Develops World's First Technology Enabling One Grinding Machine To Perform High-speed, High-Precision Machining of Diverse Gear Types: Internally Toothed, Externally Toothed and Stepped -- Also Realizes Low-cost Processing through to Finishing --
November 01, 2011
MHI to Intensify Gear Cutting Machine Marketing in the U.S.
And Aggressively Explore Demand for Overseas Production -- Technological Expertise to be on Display at Gear Expo 2011 --
October 31, 2011
Bulletin Board Notice re MHI's Support Stance for Machine Tool Users
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