MHI to Market ZGA2000 Large-size Gear Grinding Machine: First in Japan Enabling High-speed, High-Precision Machining Of Up to 2 Meter Diameter Workpieces

Machine Tool Division

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August 02, 2010MHI to Produce Gear Cutting Machines in China, Applying New "Shared Factory" Scheme

July 22, 2010World's First Direct Bonding of SiC-Si and GaN-Si at Room Temperature Achieved by MHI Bonding Machine -- Leads Way for New Device Development --

May 24, 2010MHI to Market "ZGA2000" Large-size Gear Grinding Machine: First in Japan Enabling High-speed, High-Precision Machining Of Up to 2 Meter Diameter Workpieces Achieves Significant Idle Time Reduction and Enhanced Operability

May 13, 2010MHI to Market "GEA1200", First Model in New "GEA Series": High-efficiency, High-precision Gear Hobbing Machines Enabling Machining of Over 1 Meter Diameter Large-size Gears

April 08, 2010MHI's Room-Temperature Bonding Machine for 8-inch Wafers Begins Operation at MEMS Manufacturer in Japan -- User Support Program "MBSP" Launched --

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