Exhibition Micromachine / MEMS2011
Name of the Exhibition
Exhibition Micromachine / MEMS2011
Date & Time [JST]
July 13 (Wed.) - 15 (Fri.), 2011, 10:00 a.m. - 5:00 p.m.
Venue
Tokyo Big Sight, East Hall 2, D-10
Outline of Our Presentation
We will exhibit
- (1)Wafer Bonding Machine by Room Temperature Bonding
Rigid bonding is realized by SAB (Surface Activated Bonding) technology, which can be applied for MEMS packaging, LED, RF device and Power device with its thermal stress free bonding and wide variety of bonding materials. - (2)Micro Milling machine μV1
We will exhibit wafers of hard material with micro machined patterns by Micro milling, which enables photo mask less micro machining.
It will realize short lead-time low cost prototyping of microstructures.
Exhibited products (Click on the Products Name link to view the detail.)
Admission Fee
1,000 yen per person (including tax)
Free Admission for invitation card holder
Pre-registration (link to "Exhibition Micromachine / MEMS2011" Website)
Organized by
Micromachine Center
